Odisha signs MoU with Intel and 3D Glass Solutions to bring substrate manufacturing technology to India
Bhubaneswar, May 29: The Odisha Government on Friday signed a Memorandum of Understanding (MoU) with tech giant Intel and 3D Glass Solutions (3DGS) to bring next-generation chip manufacturing technology to India. Union Minister of Electronics & IT, Ashwini Vaishnaw; along with Chief Minister of Odisha, Mohan Charan Majhi; CEO, Intel, Lip-Bu Tan, and other dignitaries, […]
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